Deposition mask apparatus, mask support mechanism, and production method for deposition mask apparatus

ABSTRACT

A deposition mask apparatus including a frame, a supporter including a plurality of supporting members fixed to the frame, and a deposition mask fixed to the frame is provided. The plurality of supporting members include at least a first supporting member that is closest to an intermediate position between a third portion and a fourth portion of the frame and a second supporting member that is located closer to the third portion of the frame than the first supporting member. The first supporting member in a state of warping downward from the frame with a first warping amount supports the deposition mask from below. The second supporting member in a state of warping downward from the frame with a second warping amount that is smaller than the first warping amount supports the deposition mask from below.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromJapanese Patent Application No. 2019-19835, filed Feb. 6, 2019; theentire contents of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION Field

Embodiments of the present disclosure relate to a deposition maskapparatus, a mask support mechanism, and a production method for adeposition mask apparatus.

Background Art

In electronic devices such as smartphones and tablet PCs,high-definition display devices are demanded from the market. A displaydevice has a pixel density of, for example, 400 ppi or more or 800 ppior more.

Attention has been paid to the organic EL display device because of itsexcellent responsibility and/or high contrast. A known method forforming pixels of the organic EL display device is attaching a materialthat constitutes pixels on a substrate by vapor deposition. In thiscase, first, a deposition mask apparatus including a deposition maskhaving holes and a frame that supports the deposition mask is prepared.Next, the deposition mask of the deposition mask apparatus is placed incontact with a substrate in the deposition apparatus. Then, an organicmaterial and/or inorganic material or the like is deposited on thesubstrate, thereby forming an organic material and/or inorganic materialor the like on the substrate.

During the vapor deposition step, the dimensional accuracy of theorganic material on the substrate and/or the accuracy of the position ofthe organic material on the substrate may be reduced due to the presenceof a gap between the deposition mask and the substrate. The cause of thegap is that the deposition mask warps by its own weight. In order tosolve such a problem, it is known that a deposition mask, a substrate,and a magnet are arranged in that order, thereby drawing the depositionmask toward the substrate using magnetic force.

PRIOR ART DOCUMENTS Patent Documents

-   Patent Document 1: Japanese Patent No. 5382259

SUMMARY OF THE INVENTION Technical Problem

Depending on the form of warping generated in the deposition mask, thegap between the deposition mask and the substrate may not besufficiently reduced even when a magnet or the like is used.

An object of an embodiment of the present disclosure is to reduce a gapbetween a deposition mask and a substrate.

Solution to Problem

A deposition mask apparatus in one embodiment of the present disclosureincludes:

a frame including a first portion, a second portion facing the firstportion across an opening in a first direction, a third portion, and afourth portion facing the third portion across the opening in a seconddirection different from the first direction, and including a firstsurface and a second surface that is located opposite to the firstsurface;

a supporter including a plurality of supporting members that arearranged in the second direction, the supporting member including afirst end that is fixed to the first portion on the first surface sideand a second end that is fixed to the second portion on the firstsurface side; and

a deposition mask including a third end that is fixed to the thirdportion on the first surface side and a fourth end that is fixed to thefourth portion on the first surface side, and including a plurality ofholes that are located between the third end and the fourth end,

in which the plurality of supporting members include at least a firstsupporting member that is closest to an intermediate position betweenthe third portion and the fourth portion of the frame and a secondsupporting member that is located closer to the third portion of theframe than the first supporting member, and

when the first surface of the frame is located above the second surface,the first supporting member in a state of warping downward from theframe with a first warping amount supports the deposition mask frombelow, and the second supporting member in a state of warping downwardfrom the frame with a second warping amount that is smaller than thefirst warping amount supports the deposition mask from below.

Advantageous Effects of Embodiment

According to the deposition mask apparatus of the embodiment of thepresent disclosure, the gap between the deposition mask and thesubstrate can be reduced.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a view for illustrating a deposition apparatus including adeposition mask apparatus according to one embodiment of the disclosure.

FIG. 2 is a plan view illustrating a deposition mask apparatus accordingto one embodiment of the disclosure.

FIG. 3 is a plan view illustrating an assembled body including a frameand a supporter fixed to the frame.

FIG. 4 is a sectional view along the A-A line of FIG. 2.

FIG. 5 is a sectional view along the B-B line of FIG. 2.

FIG. 6 is a sectional view along the C-C line of FIG. 3.

FIG. 7 is a partial plan view showing a part of the effective area ofthe deposition mask.

FIG. 8 is a sectional view along the D-D line of FIG. 7.

FIG. 9A is a schematic view for generally explaining an example of theproduction method for a deposition mask.

FIG. 9B is a view illustrating a modified example of a cooling plate.

FIG. 10 is a sectional view of a deposition substrate produced using thedeposition mask apparatus.

FIG. 11 is a plan view illustrating a modified example of the assembledbody including a frame and a supporter fixed to the frame.

FIG. 12 is a plan view illustrating a modified example of the depositionmask apparatus.

FIG. 13 is a plan view illustrating a modified example of the assembledbody including a frame and a supporter fixed to the frame.

FIG. 14 is a sectional view along the E-E line of FIG. 12.

FIG. 15 is a plan view illustrating a modified example of the assembledbody including a frame and a supporter fixed to the frame.

FIG. 16 is a plan view illustrating a modified example of the depositionmask apparatus.

FIG. 17 is a view explaining a method for evaluating the dimensionalaccuracy and positional accuracy of a deposited layer.

FIG. 18 is a plan view explaining an example of a method for measuringthe preliminary warping amount of a supporting member of a mask supportmechanism.

FIG. 19 is a sectional view along the F-F line of FIG. 18.

DETAILED DESCRIPTION OF THE INVENTION

In the present specification and the drawings, unless otherwisespecified, terms each meaning a substance that is the basis of a certainstructure, e.g., “substrate”, “base member”, “plate”, “sheet”, and“film” are not distinguished from each other based solely on thedifference in designation.

In the present specification and the drawings, unless otherwisespecified, terms specifying shapes, geometric conditions, and theirdegrees, e.g., “parallel” and “perpendicular” and values of lengths,angles, and the like are not limited to their strict definitions, butconstrued to include a range of capable of exerting a similar function.

In the present specification and the drawings, unless otherwisespecified, when a certain structure of a certain member, a certainregion, or the like is “above” or “below”, “on the upper side of” or “onthe lower side of”, or “upward toward” or “downward toward” anotherstructure of another member, another region, or the like, it includes acase in which a certain structure is in direct contact with anotherstructure. Further, this also includes a case in which further structureis included between a certain structure and another structure, whichmeans a case in which they are indirectly in contact with each other.Unless otherwise specified, the terms “above,” “upper side”, or “upward”and “below”, “lower side”, or “downward” may be interchangeable when thevertical direction is reversed.

In the present specification and the drawings, unless otherwisespecified, the same portions or portions including similar functions aredenoted by the same reference numerals or similar reference numerals,and repeated description thereof may be omitted. In addition, thedimensional ratios in the drawings may be different from actual ratiosfor convenience of description, or some of the components may be omittedfrom the drawings.

In the present specification and the drawings, unless otherwisespecified, the embodiments and examples may be combined with otherembodiments and modified examples unless there is contradiction.Further, the other embodiments, or other embodiments and modifiedexamples may be combined unless there is contradiction. Further, themodified examples may be combined with each other unless there iscontradiction.

In the present specification and the drawings, unless otherwisespecified, when a plurality of steps are disclosed in relation to amethod such as a production method, other steps that are not disclosedmay be performed between the disclosed steps. In addition, the order ofthe disclosed steps is appropriately modified unless there iscontradiction.

In the present specification and the drawings, unless otherwisespecified, the numerical ranges expressed by the sign “-” includenumerical values placed before and after the sign “-” For example, thenumerical range defined by the expression “34%-38% by mass” is the sameas the numerical range defined by the expression “34% or more and 38% orless by mass”.

In one embodiment described herein, an example relating to a depositionmask used for patterning an organic material on a substrate in a desiredpattern when producing an organic EL display device and a method forproducing the same will be described. However, without being limited tosuch an application, the present embodiment can be applied to adeposition mask used for various uses. For example, the mask of theembodiment may be used to produce an apparatus for displaying orprojecting an image or video for expressing virtual reality, so-calledVR, or augmented reality, so-called AR.

A first aspect of the present disclosure is a deposition mask apparatuswhich includes:

a frame including a first portion, a second portion facing the firstportion across an opening in a first direction, a third portion, and afourth portion facing the third portion across the opening in a seconddirection different from the first direction, and including a firstsurface and a second surface that is located opposite to the firstsurface;

a supporter including a plurality of supporting members that arearranged in the second direction, the supporting member including afirst end that is fixed to the first portion on the first surface sideand a second end that is fixed to the second portion on the firstsurface side; and

a deposition mask including a third end that is fixed to the thirdportion on the first surface side and a fourth end that is fixed to thefourth portion on the first surface side, and including a plurality ofholes that are located between the third end and the fourth end,

in which the plurality of supporting members include at least a firstsupporting member that is closest to an intermediate position betweenthe third portion and the fourth portion of the frame and a secondsupporting member that is located closer to the third portion of theframe than the first supporting member, and

when the first surface of the frame is located above the second surface,the first supporting member in a state of warping downward from theframe with a first warping amount supports the deposition mask frombelow, and the second supporting member in a state of warping downwardfrom the frame with a second warping amount that is smaller than thefirst warping amount supports the deposition mask from below.

According to a second aspect of the present disclosure, in thedeposition mask apparatus in the first aspect described above,

the plurality of supporting members includes a third supporting memberthat is located closer to the fourth portion of the frame than the firstsupporting member, and

when the first surface of the frame is located above the second surface,the third supporting member in a state of warping downward from theframe with a third warping amount that is smaller than the first warpingamount may support the deposition mask from below.

According to a third aspect of the present disclosure, in the depositionmask apparatus in the second aspect described above,

the plurality of supporting members include a fourth supporting memberthat is located closer to the third portion of the frame than the secondsupporting member and a fifth supporting member that is located closerto the fourth portion of the frame than the third supporting member, and

when the first surface of the frame is located above the second surface,the fourth supporting member in a state of warping downward from theframe with a fourth warping amount that is smaller than the secondwarping amount may support the deposition mask from below, and the fifthsupporting member in a state of warping downward from the frame with afifth warping amount that is smaller than the third warping amount maysupport the deposition mask from below.

According to a fourth aspect of the present disclosure, in thedeposition mask apparatus of each of the first to third aspectsdescribed above,

the supporting members may have a thickness that is larger than athickness of the deposition mask at a position where the deposition maskoverlaps the supporting member in plan view.

According to a fifth aspect of the present disclosure, in the depositionmask apparatus of each of the first to third aspects described above,

the supporting members may have a thickness that is twice or more of athickness of the deposition mask at a position where the deposition maskoverlaps the supporting member in plan view.

According to a sixth aspect of the present disclosure, in the depositionmask apparatus of each of the first to fifth aspects described above,

the supporting members may have a thickness of 50 μm or more.

According to a seventh aspect of the present disclosure, in thedeposition mask apparatus of each of the first to sixth aspectsdescribed above,

the supporting members may have a thickness that is 50 times or less athickness of the deposition mask at a position where the deposition maskoverlaps the supporting member in plan view.

According to an eighth aspect of the present disclosure, in thedeposition mask apparatus of each of the first to seventh aspectsdescribed above,

the supporting members may have a thickness of 1 mm or less.

According to a ninth aspect of the present disclosure, in the depositionmask apparatus of each of the first to eighth aspects described above,

the frame has a third surface facing the opening, the third surfacebeing located between the first surface and the second surface, and

the third surface of the first portion at a position where the firstportion overlaps the first supporting member in plan view may be locatedcloser to the second portion than the third surface of the first portionat a position where the first portion overlaps the second supportingmember in plan view.

According to a tenth aspect of the present disclosure, in the depositionmask apparatus of each of the first to ninth aspects described above,

the first portion and the second portion of the frame may be shorterthan the third portion and the fourth portion of the frame.

According to an eleventh aspect of the present disclosure, in thedeposition mask apparatus of each of the first to tenth aspectsdescribed above, a ratio of a length of the third portion and the fourthportion to a length of the first portion and the second portion may be1.1 or more.

A twelfth aspect of the present disclosure is a mask support mechanismfor supporting a deposition mask which includes:

a frame including a first portion, a second portion facing the firstportion across an opening in a first direction, a third portion, and afourth portion facing the third portion across the opening in a seconddirection different from the first direction, and including a firstsurface and a second surface that is located opposite to the firstsurface; and

a supporter including a plurality of supporting members that arearranged in the second direction, the supporting member including afirst end that is fixed to the first portion on the first surface sideand a second end that is fixed to the second portion on the firstsurface side,

in which the plurality of supporting members include at least a firstsupporting member that is closest to an intermediate position betweenthe third portion and the fourth portion of the frame and a secondsupporting member that is located closer to the third portion of theframe than the first supporting member, and

when the first surface of the frame is located above the second surface,the first supporting member warps downward from the frame with a firstpreliminary warping amount, and the second supporting member warpsdownward from the frame with a second preliminary warping amount that issmaller than the first preliminary warping amount.

According to a thirteenth aspect of the present disclosure, in the masksupport mechanism of the twelfth aspect described above,

the plurality of supporting members include a third supporting memberthat is located closer to the fourth portion of the frame than the firstsupporting member, and

when the first surface of the frame is located above the second surface,the third supporting member may warp downward from the frame with athird preliminary warping amount that is smaller than the firstpreliminary warping amount.

According to a fourteenth aspect of the present disclosure, in the masksupport mechanism of the thirteenth aspect described above,

the plurality of supporting members include a fourth supporting memberthat is located closer to the third portion of the frame than the secondsupporting member and a fifth supporting member that is located closerto the fourth portion of the frame than the third supporting member, and

when the first surface of the frame is located above the second surface,the fourth supporting member warps downward from the frame with a fourthpreliminary warping amount that is smaller than the second preliminarywarping amount, and the fifth supporting member warps downward from theframe with a fifth preliminary warping amount that is smaller than thethird preliminary warping amount.

According to a fifteenth aspect of the present disclosure, in the masksupport mechanism of each of the twelfth to fourteenth aspects describedabove, each of the supporting members may have a thickness of 50 μm ormore.

According to a sixteenth aspect of the present disclosure, in the masksupport mechanism of each of the twelfth to fifteenth aspects describedabove,

each of the supporting members may have a thickness of 1 mm or less.

According to a seventeenth aspect of the present disclosure, in the masksupport mechanism of each of the twelfth to sixteenth aspects describedabove,

the frame has a third surface facing the opening, which is locatedbetween the first surface and the second surface, and

the third surface of the first portion at a position where the firstportion overlaps the first supporting member in plan view may be locatedcloser to the second portion than the third surface of the first portionat a position where the first portion overlaps the second supportingmember in plan view.

According to an eighteenth aspect of the present disclosure, in the masksupport mechanism of each of the twelfth to seventeenth aspectsdescribed above,

the first portion and the second portion of the frame may be shorterthan the third portion and the fourth portion of the frame.

According to a nineteenth aspect of the present disclosure, in the masksupport mechanism of each of the twelfth to eighteenth aspects describedabove,

a ratio of a length of the third portion and the fourth portion to alength of the first portion and the second portion may be 1.1 or more.

A twentieth aspect of the present disclosure is a production method fora deposition mask apparatus which comprises:

a step of preparing a frame including a first portion, a second portionfacing the first portion across an opening in a first direction, a thirdportion, and a fourth portion facing the third portion across theopening in a second direction different from the first direction, andincluding a first surface and a second surface that is located oppositeto the first surface;

a step of fixing a first supporting member, in a state in which a firsttension is applied to the first supporting member, to the first portionand the second portion of the frame on the first surface side of theframe such that the first supporting member is closest to anintermediate position between the third portion and the fourth portionof the frame;

a step of fixing a second supporting member, in a state in which asecond tension larger than the first tension is applied to the secondsupporting member, to the first portion and the second portion of theframe on the first surface side of the frame at a position closer to thethird portion of the frame than the first supporting member; and

a step of fixing a deposition mask including a plurality of holes to thethird portion and the fourth portion of the frame on the first surfaceside of the frame after fixing the first supporting member and thesecond supporting member to the frame.

Hereinafter, an embodiment of the present disclosure will be describedin detail with reference to the drawings. The embodiment described belowis an example of an embodiment of the present disclosure, and thepresent disclosure is not construed as being limited to only such anembodiment.

Firstly, a deposition apparatus 80 for performing a deposition processfor depositing a deposition material on an object is explained withreference to FIG. 1. As shown in FIG. 1, the deposition apparatus 80 mayinclude therein a deposition source 81, a heater 83, and a depositionmask apparatus 10. In addition, the deposition apparatus 80 may furtherinclude exhaust means to create a vacuum atmosphere inside of thedeposition apparatus 80. An example of the deposition source 81 is acrucible that accommodates a deposition material 82 such as an organicluminescent material. The heater 83 is configured to heat the depositionsource 81 to evaporate the deposition material 82 in the vacuumatmosphere. The deposition mask apparatus 10 is placed opposite to thedeposition source 81.

Hereinafter, the deposition mask apparatus 10 is described. As shown inFIG. 1, the deposition mask apparatus 10 includes a frame 15 and adeposition mask 20 fixed to the frame 15. The frame 15 is configured tohold the deposition mask 20 in a taut state in the planar direction inorder to restrain the deposition mask 20 from warping.

The deposition mask apparatus 10 is disposed in a deposition apparatus80 such that the deposition mask 20 faces a substrate 91 as an object,onto which the deposition material 82 is to be deposited as shown inFIG. 1. The deposition mask 20 has a plurality of holes 25 through whichthe deposition material 82 incoming from the deposition source 81passes. In the following description, a surface of the deposition mask20 located on the side of the substrate 91 is referred to as “firstsurface 201”, and a surface of the deposition mask 20 opposite to thefirst surface 201 is referred to as “second surface 202”. The incomingdeposition material 82 adheres to the substrate 91.

The deposition mask apparatus 10 may include a cooling plate 85 disposedon a surface of the substrate 91, which is opposite to the other surfaceof the substrate 91 facing the deposition mask 20, as shown in FIG. 1.The cooling plate 85 may have a flow path for circulating a refrigerantinside the cooling plate 85. The deposition mask apparatus 10 includesthe cooling plate 85, which makes it possible to suppress an increase inthe temperature of the substrate 91 during the vapor deposition step.

Although not shown, the deposition mask apparatus 10 may include amagnet disposed on the surface of the substrate 91, which is opposite tothe other surface of the substrate 91 facing the deposition mask 20. Themagnet may be arranged on a surface of the cooling plate 85, which isopposite to the other surface of the cooling plate 85 facing thedeposition mask 20. By providing the magnet, the deposition mask can beattracted to the substrate 91 by magnetic force, and the deposition mask20 can be brought into close contact with the substrate 91. Thus, it ispossible to suppress the occurrence of shadow in the vapor depositionstep thereby improving the dimensional accuracy and positional accuracyof a deposition layer formed on the substrate 91 with the depositionmaterial 82 attached to the substrate 91. The term “shadow” used hereinrefers to a phenomenon in which the deposition material 82 enters a gapbetween the deposition mask 20 and the substrate 91, thereby causing thethickness of the deposition layer to be uneven. Alternatively, thedeposition mask 20 may be brought into close contact with the substrate91 by using an electrostatic chuck that utilizes electrostatic force.

FIG. 2 is a plan view of the deposition mask apparatus 10 when viewedfrom the first surface 201 side of the deposition mask 20. As shown inFIG. 2, the deposition mask apparatus 10 may include a plurality ofdeposition masks 20 arranged in a first direction D1. In thisembodiment, each deposition mask 20 has a rectangular shape extending ina second direction D2 crossing the first direction D1. Each depositionmask 20 is fixed via both end portions in the longitudinal direction ofthe deposition mask 20 to the frame 15 by being welded, for example.

As shown in FIG. 2, the deposition mask apparatus 10 may include asupporter 60 located between the frame 15 and the deposition mask 20.The supporter 60 may be fixed to the frame 15. FIG. 3 is a plan viewshowing a state in which the deposition mask 20 has been removed fromthe deposition mask apparatus 10 in FIG. 2 in order to clearly show thesupporter 60. The component including the frame 15 and the supporter 60may be also referred to as “mask support mechanism 75”.

Hereinafter, the frame 15, the deposition mask 20, and the supporter 60of the deposition mask apparatus 10 will be described in detail.

Firstly, the frame 15 will be described. As shown in FIGS. 2 and 3, theframe 15 has a frame member including a first portion 151, a secondportion 152, a third portion 153, and a fourth portion 154, and anopening 155 inside the frame member. The first portion 151 and thesecond portion 152 face each other across the opening 155 in the firstdirection D1. The third portion 153 and the fourth portion 154 face eachother across the opening 155 in a second direction D2 different from thefirst direction D1.

As shown in FIGS. 2 and 3, the first direction D1 and the seconddirection D2 may be orthogonal to each other. The first portion 151 andthe second portion 152 may extend in the second direction D2. The thirdportion 153 and the fourth portion 154 may extend in the first directionD1.

As shown in FIGS. 2 and 3, the first portion 151 and the second portion152 of the frame 15 may be shorter than the third portion 153 and thefourth portion 154. As shown in FIG. 2, on the first surface 16 side ofthe frame 15, the end portions of the supporter 60 may be fixed to thefirst portion 151 and the second portion 152. On the first surface 16side of the frame 15, the end portions of the deposition mask 20 may befixed to the third portion 153 and the fourth portion 154. In this case,as shown in FIG. 2, the supporter 60 is longer than the deposition mask20.

The ratio of the length of the third portion 153 and the fourth portion154 to the length of the first portion 151 and the second portion 152may be, for example, 1.1 or more, 1.2 or more, or 1.3 or more. The ratioof the length of the third portion 153 and the fourth portion 154 to thelength of the first portion 151 and the second portion 152 may be, forexample, 1.5 or less, 1.7 or less, or 2.0 or less. The ratio of thelength of the third portion 153 and the fourth portion 154 to the lengthof the first portion 151 and the second portion 152 may be in a rangedefined by a first group consisting of 1.1, 1.2, and 1.3 and/or a secondgroup consisting of 1.5, 1.7, and 2.0. The ratio of the length of thethird portion 153 and the fourth portion 154 to the length of the firstportion 151 and the second portion 152 may be in a range determined by acombination of any one of the values included in the first group and anyone of the values included in the second group. The ratio of the lengthof the third portion 153 and the fourth portion 154 to the length of thefirst portion 151 and the second portion 152 may be in a rangedetermined by a combination of any two of the values included in thefirst group. The ratio of the length of the third portion 153 and thefourth portion 154 to the length of the first portion 151 and the secondportion 152 may be in a range determined by a combination of any two ofthe values included in the second group. For example, the ratio may be1.1 or more and 2.0 or less, 1.1 or more and 1.7 or less, 1.1 or moreand 1.5 or less, 1.1 or more and 1.3 or less, 1.1 or more and 1.2 orless, 1.2 or more and 2.0 or less, 1.2 or more and 1.7 or less, 1.2 ormore and 1.5 or less, 1.2 or more and 1.3 or less, 1.3 or more and 2.0or less, 1.3 or more and 1.7 or less, 1.3 or more and 1.5 or less, 1.5or more and 2.0 or less, 1.5 or more and 1.7 or less, or 1.7 or more and2.0 or less.

As a material forming the frame 15, the same material as a material of ametal plate for the deposition mask 20 described later can be used. Forexample, an iron alloy containing nickel can be used.

Next, the deposition mask 20 will be described. As shown in FIG. 2, thedeposition mask 20 may have a pair of end parts 21 fixed to the frame15, and an intermediate part 22 located between the end parts 21. In thefollowing description, one of the pair of end parts 21, which is fixedto the third portion 153 of the frame 15, is also referred to as “thirdend 211”, and the other of the pair of end parts 21, which is fixed tothe fourth portion 154 of the frame 15, is also referred to as “fourthend 212”.

The intermediate part 22 of the deposition mask 20 may have at least oneeffective area 23 and a peripheral area 24 located around the effectivearea 23. In the example shown in FIG. 2, the intermediate part 22includes a plurality of effective areas 23 arranged at predeterminedintervals along the second direction D2. The peripheral area 24surrounds a plurality of effective areas 23.

In a case in which a display device such as an organic EL display deviceis produced using the deposition mask 20, one effective area 23corresponds to a display area of one organic EL display device.Therefore, the deposition mask apparatus 10 shown in FIG. 2 can form thedeposition layer constituting the organic EL display devices on onesubstrate. A single effective area 23 may also correspond to a pluralityof display areas. Although not shown, a plurality of effective areas 23may be arranged at predetermined intervals in the width direction of thedeposition mask 20.

Each effective area 23 has an outline of, for example, a substantiallyquadrangular shape in plan view, more precisely, a substantiallyrectangular shape in plan view. Although not shown, each effective area23 can have an outline of a different shape in accordance with the shapeof the display area of the organic EL display device. For example, eacheffective area 23 may have a circular outline. The plan view means thatthe deposition mask apparatus 10 is viewed along the normal direction ofthe first surface 16 of the frame 15.

Next, the supporter 60 will be described. As shown in FIGS. 2 and 3, thesupporter 60 may include a plurality of supporting members arranged inthe second direction D2. In the examples shown in FIGS. 2 and 3, thesupporter 60 includes seven supporting members. Each supporting membermay include an end portion fixed to the first portion 151 on the firstsurface 16 side of the frame 15 and an end portion fixed to the secondportion 152 on the first surface 16 side of the frame 15. In thefollowing description, the end portion of the supporting member fixed tothe first portion 151 is also referred to as “first end 601”, and theend portion of the supporting member fixed to the second portion 152 isalso referred to as “second end 602”.

The plurality of supporting members include at least a first supportingmember 61 and a second supporting member 62. The first supporting member61 is closest to an intermediate position between the third portion 153and the fourth portion 154 of the frame 15. The second supporting member62 is located closer to the third portion 153 than the first supportingmember 61. The “intermediate position between the third portion 153 andthe fourth portion 154” is a position where the distance to the thirdportion 153 and the distance to the fourth portion 154 in the seconddirection D2 are equal. In FIG. 3, an alternate long and short dash linedenoted by a reference sign M indicates an intermediate position betweenthe third portion 153 and the fourth portion 154. When there is asupporting member overlapping the intermediate position in plan view,the supporting member overlapping the intermediate position is the firstsupporting member 61 closest to the intermediate position. In theexample shown in FIG. 3, the first supporting member 61 overlaps anintermediate position between the third portion 153 and the fourthportion 154. When there is not a supporting member overlapping theintermediate position in plan view, the supporting member having aminimum distance from the intermediate position is the first supportingmember 61 closest to the intermediate position. In FIG. 3, a referencesign Z2 denotes a distance between the intermediate position and thesecond supporting member 62. A reference sign Z3 denotes a distancebetween the intermediate position and the third supporting member 63.The plurality of supporting members may further include a thirdsupporting member 63 located closer to the fourth portion 154 than thefirst supporting member 61. Further, the plurality of supporting membersmay further include a fourth supporting member 64 located closer to thethird portion 153 than the second supporting member 62. The plurality ofsupporting members may further include a fifth supporting member 65located closer to the fourth portion 154 than the third supportingmember 63. The plurality of supporting members may further include asixth supporting member 66 located closer to the third portion 153 thanthe fourth supporting member 64. Further, the plurality of supportingmembers may further include a seventh supporting member 67 locatedcloser to the fourth portion 154 than the fifth supporting member 65.

As shown in FIG. 2, the plurality of supporting members of the supporter60 may overlap a peripheral area 24 of the deposition mask 20 in planview. Thus, the deposition material that has passed through the holes inthe effective area 23 of the deposition mask 20 can be restrained fromadhering to the supporter 60.

As a material forming each supporting member of the supporter 60, thesame material as a material of a metal plate for the deposition mask 20described later can be used. For example, an iron alloy containingnickel can be used.

Next, a cross-sectional structure of the deposition mask apparatus 10will be described with reference to FIGS. 4 and 5. FIG. 4 is across-sectional view taken along the line A-A of FIG. 2 passing throughthe first supporting member 61. FIG. 5 is a cross-sectional view takenalong the line B-B of FIG. 2 through the deposition mask 20 at anintermediate position between the first portion 151 and the secondportion 152.

As shown in FIGS. 4 and 5, the frame 15 includes a first surface 16, asecond surface 17, a third surface 18, and a fourth surface 19. Thefirst surface 16 is located on the side where the deposition mask 20 andthe supporter 60 are fixed to the frame 15. The second surface 17 islocated opposite side of the first surface 16. The third surface 18 islocated between the first surface 16 and the second surface 17 and facesthe opening 155. The fourth surface 19 is located on the opposite sideof the third surface 18 in the horizontal direction.

As shown in FIG. 4, the first surface 16 may include a fifth surface 162and a sixth surface 161 located closer to the second surface 17 than thefifth surface 162. The fifth surface 162 may be located on the sameplane as the first surface 16 of the third portion 153 and the fourthportion 154 to which the deposition mask 20 is fixed. The sixth surface161 may be connected to the third surface 18. Supporting members such asthe first supporting member 61 may be fixed to the sixth surface 161.The sixth surface 161 may be formed by cutting a part of the fifthsurface 162.

Supporting members such as the first supporting member 61 of thesupporter 60 are located between the frame 15 and the deposition mask 20on the first surface 16 side. Supporting members such as the firstsupporting member 61 function to support the deposition mask 20 thatwarps downward by its own weight from below. Note that supportingmembers such as the first supporting member 61 also warps downward dueto its own weight and the force received from the deposition mask 20.

The downward warping amount of a supporting member when the firstsurface 16 of the frame 15 is located above the second surface 17 willbe described. In the cross-sectional views such as FIGS. 4 and 5, anarrow Y1 represents an upper side and an arrow Y2 represents a lowerside.

In FIG. 4, a reference sign a1 denotes the downward warping amount ofthe first supporting member 61. The warping amount is a verticaldistance between a portion of the first supporting member 61 fixed tothe frame 15 and a lowermost portion of the first supporting member 61.In the example illustrated in FIG. 4, a portion of the first supportingmember 61 at an intermediate position between the first portion 151 andthe second portion 152 is located at the lowest position. As a measuringinstrument for measuring the warping amount, a laser displacement metersuch as LK-G85 manufactured by KEYENCE CORPORATION can be used. In thefollowing description, the warping amount of the first supporting member61 is also referred to as “first warping amount a1”. A horizontal planepassing through a portion of the first supporting member 61 fixed to theframe 15 is also referred to as “first reference plane P1”.

As shown in FIG. 5, other supporting members such as the secondsupporting member 62 and the third supporting member 63 may warpdownward. In FIG. 5, a reference sign a2 denotes a downward warpingamount of the second supporting member 62, and a reference sign a3denotes a downward warping amount of the third supporting member 63. Inthe following description, the warping amount of the second supportingmember 62 is also referred to as “second warping amount a2”, and thewarping amount of the third supporting member 63 is also referred to as“third warping amount a3”. Although not shown, regarding the supportingmembers subsequent to the fourth supporting member 64 the warping amountof the n-th supporting member is also referred to as “n-th warpingamount”, and is denoted by a reference sign “an”. n is a natural number.The method for measuring the warping amount of each supporting member isthe same as the method for measuring the first warping amount a1 of thefirst supporting member 61.

The plurality of supporting members of the supporter 60 are fixed to theframe 15 such that the supporting member located closer to the thirdportion 153 or the fourth portion 154 of the frame 15 has a smallerwarping amount. For example, the second warping amount a2 of the secondsupporting member 62 and the third warping amount a3 of the thirdsupporting member 63 are smaller than the first warping amount a1 of thefirst supporting member 61. The fourth warping amount a4 of the fourthsupporting member 64 is smaller than the second warping amount a2 of thesecond supporting member 62. The fifth warping amount a5 of the fifthsupporting member 65 is smaller than the third warping amount ofdeflection a3 of the third supporting member 63. The sixth warpingamount a6 of the sixth supporting member 66 is smaller than the fourthwarping amount a4 of the fourth supporting member 64. The seventhwarping amount a7 of the seventh supporting member 67 is smaller thanthe fifth warping amount a5 of the fifth supporting member 65. Such arelationship is represented by the following relational expressions.a1>a2>a4>a6a1>a3>a5>a7

By adjusting the warping amounts of the plurality of supporting membersof the supporter 60 as described above, the downward warping amount ofthe deposition mask 20 can be maximized at an intermediate positionbetween the third portion 153 and the fourth portion 154 as shown inFIG. 5. In addition, the supporter 60 can support the deposition mask 20such that the downward warping amount of the deposition mask 20decreases from the intermediate position between the third portion 153and the fourth portion 154 to the third portion 153 or the fourthportion 154.

In FIG. 5, a reference sign b1 denotes the downward warping amount ofthe deposition mask 20. As in the case of supporting members such as thefirst supporting member 61, the warping amount b1 of the deposition mask20 corresponds to a vertical distance between the portion of thedeposition mask 20 fixed to the frame 15 and the lowermost portion ofthe deposition mask 20. A horizontal plane passing through a portion ofthe deposition mask 20 fixed to the frame 15 is also referred to as“second reference plane P2”.

In FIG. 5, a reference sign L1 denotes a distance between the thirdportion 153 and the fourth portion 154 of the frame 15. b1/L1 ispreferably 0.00228 or less. b1/L1 may be 0.00171 or less, or may be0.00114 or less. Accordingly, it is possible to reduce the generation ofa gap between the deposition mask 20 and the substrate 91. b1/L1 ispreferably 0.00008 or more. b1/L1 may be 0.00014 or more, and may be0.00029 or more.

The range of b1/L1 may be determined based on a combination of any of aplurality of upper limit candidate values and any of a plurality oflower limit candidate values. For example, b1/L1 may be 0.00008 or moreand 0.00228 or less, 0.00014 or more and 0.00171 or less, or 0.00029 ormore and 0.00114 or less. In addition, the range of the b1/L1 may bedetermined based on a combination of any two of a plurality of upperlimit candidate values. For example, b1/L1 may be 0.00171 or more and0.00228 or less. The range of the b1/L1 may be determined based on acombination of any two of a plurality of lower limit candidate values.For example, b1/L1 may be 0.00008 or more and 0.00014 or less.

FIG. 6 is a sectional view along the C-C line of FIG. 3. As shown inFIG. 6, the supporter 60 in a state of not supporting the depositionmask 20 may also warp due to its weight. The warping amount in the n-thsupporting member of the supporter 60 in a state of not supporting thedeposition mask 20 is also referred to as “preliminary n-th warpingamount”, and is denoted by a reference sign “cn”. “n” is a naturalnumber. The method for measuring the preliminary warping amount of eachsupporting member is the same as the method for measuring the firstwarping amount a1 of the first supporting member 61. Regarding thepreliminary warping amount cn, as in the case of the above-describedwarping amount an, the following relational expressions may besatisfied.c1>c2>c4>c6c1>c3>c5>c7

The thickness of each supporting member of the supporter 60 isdetermined to satisfy the above-described relationship of the warpingamount. The thickness of each supporting member of the supporter 60 ispreferably 50 μm or more. The thickness of each supporting member of thesupporter 60 may be 60 μm or more, or 70 μm or more. Thus, it ispossible to restrain the warping amount of each supporting member of thesupporter 60 from becoming too large. In addition, the thickness of eachsupporting member of the supporter 60 is preferably 1 mm or less. Thethickness of each supporting member of the supporter 60 may be 500 μm orless, or 200 μm or less. Thus, the deposition material that has passedthrough the holes in the effective area 23 of the deposition mask 20 canbe restrained from adhering to the supporter 60. The thickness of eachsupporting member of the supporter 60 is, for example, 100 μm.

The range of thickness of each supporting member of the supporter 60 maybe determined based on a combination of any of a plurality of upperlimit candidate values and any of a plurality of lower limit candidatevalues. For example, the thickness of each supporting member of thesupporter 60 may be 50 μm or more and 1 mm or less, 60 μm or more and500 μm or less, or 70 μm or more and 200 μm or less. In addition, therange of the thickness of each supporting member of the supporter 60 maybe determined based on a combination of any two of a plurality of upperlimit candidate values. For example, the thickness of each supportingmember of the supporter 60 may be 500 μm or more and 1 mm or less. Therange of the thickness of each supporting member of the supporter 60 maybe determined based on a combination of any two of a plurality of lowerlimit candidate values. For example, the thickness of each supportingmember of the supporter 60 may be 50 μm or more and 60 μm or less. Bysetting the thickness of the supporting member to 1 mm or less, thenumber of steps required to cut the fifth surface 162 of the frame 15 toform the sixth surface 161 can be reduced.

A preferable range of thickness of each supporting member of thesupporter 60 may be determined to be a relative value with respect tothickness of the deposition mask 20 at a position where the depositionmask overlaps the supporter 60 in plan view. The deposition mask 20 issupported by the supporter 60 from below at a position where thedeposition mask overlaps the supporter 60 in plan view. Preferably, thethickness of each supporting member of the supporter 60 is larger thanthe thickness of the deposition mask 20 at a position where thedeposition mask overlaps the supporter 60 in plan view. For example, theratio of the thickness of each supporting member to the thickness of thedeposition mask 20 is preferably 2 or more. The ratio may be 2.5 orhigher, or 3 or higher. In addition, the ratio of the thickness of eachsupporting member to the thickness of the deposition mask 20 ispreferably 50 or less. The ratio may be 40 or less, or 30 or less.

Further, the range of the thickness of each supporting member to thethickness of the deposition mask 20 may be determined based on acombination of any of the plurality of upper limit candidate valuesdescribed above and any of the plurality of lower limit candidate valuesdescribed above. For example, the ratio may be 2 or more and 50 or less,or 2.5 or more and 40 or less. In addition, the range of the ratio maybe determined based on a combination of any two of a plurality of upperlimit candidate values. For example, the ratio may be 40 or more and 50or less. The range of the ratio may be determined based on a combinationof any two of a plurality of lower limit candidate values. For example,the ratio may be 2 or more and 2.5 or less.

Next, an example of the structure of the deposition mask 20 will bedescribed. FIG. 7 is a plan view showing the enlarged effective area 23when viewed from the second surface 202 side of deposition mask 20. Asshown in FIG. 7, a plurality of holes 25 formed in each effective area23 are arranged at predetermined pitches along two directionsperpendicular to each other.

FIG. 8 is a sectional view along the D-D line of the effective area 23of FIG. 7. As shown in FIG. 8, the plurality of holes 25 extend from thefirst surface 201 of the deposition mask 20 to the second surface 202.The holes 25 have a first recess 30 located on the first surface 511 ofthe metal plate 51 constituting the deposition mask 20 and a secondrecess 35 located on the second surface 512 on the opposite side of thefirst surface 511, which is connected to the first recess 30. The firstrecess 30 and the second recess 35 are formed by etching the metal plate51 from the first surface 511 side and the second surface 512 side,respectively.

As shown in FIGS. 7 and 8, a wall surface 31 of the first recess 30 anda wall surface 36 of the second recess 35 may be connected via acircumferential connection portion 41. The connection portion 41 maydefine an passing portion 42 where an opening area of each hole 25 isminimum in plan view of the deposition mask 20.

As shown in FIG. 8, the adjacent two holes 25 on the first surface 201side of the deposition mask 20 are spaced from each other on the firstsurface 511 of the metal plate 51. The adjacent two second recesses 35may be also spaced from each other on the second surface 512 of themetal plate 51 on the second surface 202 side of the deposition mask 20.Namely, the second surface 512 of the metal plate 51 may remain betweenthe two adjacent second recesses 35. In the description below, a portionof the effective area 23 of the second surface 512 of the meal plate 51,which is not etched and thus remains, is also referred to as “topportion 43”. By producing the deposition mask 20 such that such a topportion 43 remains, the deposition mask 20 can have a sufficientstrength. Thus, it can be restrained that the deposition mask 20 isdamaged during transport, for example. In a case in which the width ofthe top portion 43 is too large, adhesion of a deposition material to aregion overlapping the holes of the deposition mask 20 on a depositionobject such as the substrate 91 is inhibited by the second surface 202and/or the wall surface of the deposition mask 20. As a result, theutilization efficiency of the deposition material 82 may decrease. Thus,the deposition mask 20 is preferably produced such that the width β ofthe top portion 43 is excessively large.

In the vapor deposition step, the first surface 201 of the depositionmask 20 faces the substrate 91, and the second surface 202 of thedeposition mask 20 is located toward a crucible 81 holding thedeposition material 82. The deposition material 82 adheres to thesubstrate 91 through the second recess 35 whose opening area graduallydecreases. As shown by the arrow in FIG. 8 extending from the secondsurface 202 toward the first surface 201, the deposition material 82 notonly moves from the crucible 81 toward the substrate 91 along the normaldirection N of the substrate 91, but also sometimes moves along adirection largely inclined with respect to the normal direction N of thesubstrate 91. At this time, when the thickness of the deposition mask 20is large, the deposition material 82 moving diagonally tends to be stuckon the top portion 43, the wall surface 36 of the second recess 35, orthe wall surface 31 of the first recess 30. As a result, the proportionof the deposition material 82 that cannot pass through the holes 25increases. Thus, in order to improve a utilization efficiency of thedeposition material 82, it is considered to be preferable that thethickness T of the deposition mask 20 is reduced so that heights of thewall surface 36 of the second recess 35 and the wall surface 31 of thefirst recess 30 are reduced. Namely, it can be said that it ispreferable that a metal plate 51, which has the thickness T as small aspossible as long as the strength of the deposition mask 20 is ensured,is used as the metal plate 51 for constituting the deposition mask 20.In consideration of this point, in the present embodiment, the thicknessT of the deposition mask 20 is preferably 100 μm or less. The thicknessT of the deposition mask 20 may be 50 μm or less, 40 μm or less, 35 μmor less, 30 μm or less, 25 μm or less, or 20 μm or less. Meanwhile, whenthe thickness of the deposition mask 20 is excessively small, strengthof the deposition mask 20 is reduced, which is likely to cause damage ordeformation of the deposition mask 20. In consideration of this point,the thickness T of the deposition mask 20 is preferably 5 μm or more.The thickness T of the deposition mask 20 may be 8 μm or more, 10 μm ormore, 12 μm or more, 13 μm or more, or 15 μm or more.

The range of the thickness T of the deposition mask 20 may be determinedbased on a combination of any of the plurality of upper limit candidatevalues described above and any of the plurality of lower limit candidatevalues described above. For example, the thickness T of the depositionmask 20 may be in a range of 5 μm or more and 100 μm or less, 8 μm ormore and 50 μm or less, 10 μm or more and 40 μm or less, 12 μm or moreand 35 μm or less, 13 μm or more and 30 μm or less, 15 μm or more and 25μm or less, or 15 μm or more and 20 μm or less. In addition, the rangeof the thickness T of the deposition mask 20 may be determined based ona combination of any two of the plurality of upper limit candidatevalues described above. For example, the thickness T of the depositionmask 20 may be in a range of 20 μm or more and 25 μm or less. Inaddition, the range of the thickness T of the deposition mask 20 may bedetermined based on a combination of any two of the plurality of lowerlimit candidate values described above. For example, the thickness T ofthe deposition mask 20 may be in a range of 13 μm or more and 15 μm orless.

The thickness T is a thickness of the peripheral area 24, i.e., athickness of a part of the deposition mask 20 where the first recess 30and the second recess 35 are not formed. Therefore, the thickness T canbe said as a thickness of the metal plate 51.

As a method for measuring the thickness of the metal plate 51, thedeposition mask 20, and the above-described supporter 60, a contact-typemeasurement method is employed. For a contact-type measuring method,“MT1271”, a HEIDENHAIM-METRO length gauge manufactured by HEIDENHAIN andequipped with a guide ball bushing-type plunger is used.

In FIG. 8, the reference sign a represents a width of a portion(hereinafter also referred to as “rib portion”) of the effective area 23of the first surface 511 of the metal plate 51, which is not etched andthus remains. A width α of the rib portion and a size r of the passingportion 42 are suitably determined depending on a size of an organic ELdisplay device and its display pixels.

Although not shown, etching may be performed such that two adjacentsecond recesses 35 are connected to each other. Namely, there may be apart where no second surface 512 of the metal plate 51 remains betweentwo adjacent second recesses 35. Although not shown, etching may beperformed such that two adjacent second recesses 35 are connected toeach other over the entire second surface 512.

As a material of the metal plate 51, for example, an iron alloycontaining nickel can be used. The iron alloy may further contain cobaltas well as nickel. For example, it is possible to use, as a material forthe metal plate 51, an iron alloy containing nickel and cobalt at atotal content of 30% or more and 54% or less by mass in which the cobaltcontent is 0% or more and 6% or less by mass. Concrete examples of aniron alloy containing nickel or nickel and cobalt may be an invarmaterial containing nickel of 34% or more and 38% or less by mass, asuper invar material containing cobalt in addition to nickel of 34% ormore and 38% or less by mass, or a low thermal expansion Fe—Ni basedplated alloy containing nickel of 38% or more and 54% or less by mass.By using such an iron alloy, the thermal expansion coefficient of themetal plate 51 can be reduced. For example, when a glass substrate isused as the substrate 91, the thermal expansion coefficient of the metalplate 51 can be set to a low value equal or proximate to that of theglass substrate. Accordingly, during the vapor deposition step, thedimensional accuracy and the positional accuracy of the deposition layerformed on the substrate 91 can be suppressed from being reduced due tothe difference in thermal expansion coefficient between the depositionmask 20 including the metal plate 51 and the substrate 91.

Next, a method for manufacturing the deposition mask apparatus 10described above will be described.

First, as shown in FIG. 3, a frame 15 provided with an opening 155 isprepared. The method for producing the frame 15 is appropriatelydetermined. For example, the frame 15 can be manufactured by cutting ablock of a material such as the above-described invar material formingthe frame 15.

Next, as shown in FIG. 3, a supporter fixing step of fixing the firstend 601 and the second end 602 of the plurality of supporting members ofthe supporter 60 to the first portion 151 and the second portion 152 ofthe frame 15 is performed. The first end 601 and the second end 602 arefixed by being welded, for example. At this time, as shown in FIG. 6, aplurality of supporting members may be fixed to the frame 15 so that thepreliminary warping amount increases as a supporting member ispositioned closer to the intermediate position between the third portion153 and the fourth portion 154.

In the supporter fixing step, the supporter may be fixed to the frame 15in order from the supporting member located near the intermediateposition between the third portion 153 and the fourth portion 154. Forexample, first, the first supporting member 61 may be fixed to the frame15, and then, the second supporting member 62 and the third supportingmember 63 may be fixed to the frame 15. Thereafter, the fourthsupporting member 64 and the 5th supporting member 65 may be fixed tothe frame 15, and then the sixth supporting member 66 and the seventhsupporting member 67 may be fixed to the frame 15.

Alternatively, in the supporter fixing step, the supporting memberslocated far from the intermediate position between the third portion 153and the fourth portion 154 may be fixed to the frame 15 in order. Forexample, first, the sixth supporting member 66 and the seventhsupporting member 67 may be fixed to the frame 15, and then, the fourthsupporting member 64 and the fifth supporting member 65 may be fixed tothe frame 15. Thereafter, the second supporting member 62 and the thirdsupporting member 63 may be fixed to the frame 15, and then the firstsupporting member 61 may be fixed to the frame 15.

When fixing the supporting members of the supporter 60 to the frame 15,a force may be applied to the frame 15 such that the first portion 151and the second portion 152 are elastically deformed inward as shown inFIG. 3. By elastically deforming the first portion 151 and the secondportion 152 inward, it is possible to apply a force due to restoringforce of the first portion 151 and the second portion 152 to thesupporting members of the supporter 60 fixed to the first portion 151and the second portion 152. In this case, by adjusting the restoringforce generated in the first portion 151 and the second portion 152, thepreliminary warping amount of each supporting member of the supporter 60can satisfy the above-described relational expression.

In a case in which a force is applied to the frame 15 such that thefirst portion 151 and the second portion 152 are elastically deformedinward, the third surface 18 of the first portion 151 at a positionwhere the third surface overlaps the first supporting member 61 in planview may be located closer to the second portion 152 than the thirdsurface 18 of the first portion 151 at a position where the thirdsurface overlaps the second supporting member 62 in plan view. In thiscase, a portion of the first portion 151 to which the first end 601 ofthe first supporting member 61 is welded may be located closer to thesecond portion 152 than a portion of the first portion 151 to which thefirst end 601 of the second supporting member 62 is welded. Such apositional relationship may occur when the length of the firstsupporting member 61 is the same as the length of the second supportingmember 62.

The third surface 18 of the second portion 152 at a position where thesecond portion overlaps the first supporting member 61 in plan view maybe located closer to the first portion 151 than the third surface 18 ofthe second portion 152 at a position where the second portion overlapsthe second supporting member 62 in plan view. In this case, a portion ofthe first portion 152 to which the second end 602 of the firstsupporting member 61 is welded may be located closer to the firstportion 151 than a portion of the second portion 152 to which the secondend 602 of the second supporting member 62 is welded. Such a positionalrelationship may occur when the length of the first supporting member 61is the same as the length of the second supporting member 62.

In FIG. 3, a third surface 18 of each of the first portion 151 and thesecond portion 152 at a position where each of the first portion 151 andthe second portion 152 overlaps the first supporting member 61 in planview is denoted by reference numeral 181. A third surface 18 of each ofthe first portion 151 and the second portion 152 at a position whereeach of the first portion 151 and the second portion 152 overlaps thesecond supporting member 62 in plan view is denoted by reference numeral182.

Subsequently, as shown in FIG. 2, a mask fixing step of fixing the thirdend 211 and the fourth end 212 of the deposition mask 20 to the thirdportion 153 and the fourth portion 154 of the frame 15 is performed. Thethird end 211 and the fourth end 212 are fixed by being welded, forexample. In the mask fixing step, the deposition mask 20 is fixed to theframe 15 while applying tension to the deposition mask 20 such that theholes 25 are appropriately arranged with respect to the substrate 91.Thus, a deposition mask apparatus 10 including the frame 15, thesupporter 60, and the deposition mask 20 can be obtained.

In the mask fixing step, a force may be applied to the frame 15 suchthat the third portion 153 and the fourth portion 154 are elasticallydeformed inward. Thus, a force due to restoring force of the thirdportion 153 and the fourth portion 154 can be applied to the depositionmask 20 fixed to the third portion 153 and the fourth portion 154thereby making it possible to restrain the deposition mask 20 fromwarping.

Here, when the force applied to the deposition mask 20 becomes toolarge, wrinkles may be generated in the deposition mask 20, and thepositions of some holes 25 may deviate from the design. In thisembodiment, the deposition mask apparatus 10 includes the supporter 60that supports the deposition mask 20 from below. Thus, it is possible toreduce the occurrence of looseness in the deposition mask 20 whilereducing the generation of wrinkles in the deposition mask 20.

Next, a deposition method for performing the vapor deposition of thedeposition material 82 on the substrate 91 using the deposition maskapparatus 10 will be described. First, a step of combining thedeposition mask apparatus 10 and the substrate 91 is performed. Forexamples, as shown by an arrow Q1 in FIG. 9A, the substrate 91 isrelatively moved toward the deposition mask 20 of the deposition maskapparatus 10, and the substrate 91 is brought into contact with thedeposition mask 20.

In this embodiment, the first supporting member 61, which is closest tothe intermediate position of the third portion 153 and the fourthportion 154, supports the deposition mask 20 from below in a state ofwarping with a first warping amount a1. The second supporting member 62,which is located closer to the third portion 153 than the firstsupporting member 61, supports the deposition mask 20 from below in astate of warping with a second warping amount a2 smaller than a firstwarping amount a1. The third supporting member 63, which is locatedcloser to the fourth portion 154 than the first supporting member 61,supports the deposition mask 20 from below in a state of warping with athird warping amount a3 smaller than a first warping amount a1. Inaddition, the other supporting members also support the deposition mask20 from below in a state where the tension of the supporting members isadjusted such that the warping amount decreases as the distance from thefirst supporting member 61 to the third portion 153 side or the fourthportion 154 side decreases. Therefore, the downward warping amount ofthe deposition mask 20 can be maximized at an intermediate positionbetween the third portion 153 and the fourth portion 154 as shown inFIG. 5. In addition, the downward warping amount of the deposition mask20 can be decreased from the intermediate position between the thirdportion 153 and the fourth portion 154 to the third portion 153 or thefourth portion 154.

As described above, by monotonously changing the warping amount of thedeposition mask 20, it is possible to causing a contact between thesubstrate 91 and the deposition mask 20 in order in the second directionD2 when bringing the substrate 91 into contact with the deposition mask20. For example, it is possible to first cause a contact between thesubstrate 91 and the deposition mask 20 at the intermediate positionbetween the third portion 153 and the fourth portion 154, and then,change a contact position in order from the intermediate position towardthe third portion 153 and from the intermediate position toward thefourth portion 154. Alternatively, it is possible to first cause acontact between the substrate 91 and the deposition mask 20 near thethird portion 153 and the fourth portion 154, and then, change a contactposition in order toward the intermediate position between the thirdportion 153 and the fourth portion 154. As described above, by causing acontact between the substrate 91 and the deposition mask 20 in order inthe second direction D2, it is possible to reduce the generation of agap between the substrate 91 and the deposition mask 20 as compared witha case in which a contact is made simultaneously at a plurality ofpositions on the second direction D2.

Preferably, the warping amount d1 of the substrate 91 is larger than thewarping amount b1 of the deposition mask 20. In other words, it ispreferable to adjust the tension applied to each supporting member ofthe supporter 60 such that the warping amount b1 of the deposition mask20 is smaller than the warping amount d1 of the substrate 91. Thus, itis possible to first cause a contact between the substrate 91 and thedeposition mask 20 at the intermediate position between the thirdportion 153 and the fourth portion 154, and then, change a contactposition in order from the intermediate position toward the thirdportion 153 and from the intermediate position toward the fourth portion154.

Then, as shown by arrow Q2 in FIG. 9A, a step of relatively moving thecooling plate 85 toward the substrate 91 so as to bring the coolingplate 85 into contact with the substrate 91 may be performed. Thewarping amount e1 of the cooling plate 85 is larger than the warpingamount b1 of the deposition mask 20. The warping amount e1 of thecooling plate 85 may be larger than the warping amount d1′ of thesubstrate 91. The warping amount d1′ means the warping amount of thesubstrate 91 in a state of being in contact with the deposition mask 20.By making the warping amount e1 of the cooling plate 85 larger than thewarping amount d1′ of the substrate 91, it is possible to first cause acontact between the substrate 85 and the substrate 91 at theintermediate position between the third portion 153 and the fourthportion 154, and then, change a contact position in order from theintermediate position toward the third portion 153 and from theintermediate position toward the fourth portion 154.

The cooling plate 85 may have a curved surface that forms a protrusiontoward the substrate 91 as shown in FIG. 9B. In this case, theprotrusion amount e2 of the surface of the cooling plate 85 with respectto the surface of the substrate 91 is larger than the warping amount b1of the deposition mask 20. The protrusion amount e2 may be larger thanthe warping amount d1 of the substrate 91. Thus, even in a case in whichthe cooling plate 85 does not warp or slightly warps, it is possible tofirst cause a contact between the cooling plate 85 and the substrate 91at the intermediate position between the third portion 153 and thefourth portion 154, and then, change a contact position in order fromthe intermediate position toward the third portion 153 and from theintermediate position toward the fourth portion 154.

Thereafter, although not shown, a magnet may be disposed on the surfaceof the cooling plate 85, which is opposite to the other surface of thecooling plate 85 facing the deposition mask 20. Accordingly, thedeposition mask can be attracted toward the substrate 91 by the magneticforce.

Next, the deposition material 82 is evaporated to fly to the substrate91. It is possible for the deposition material 82 to adhere to thesubstrate 91 in a pattern corresponding to the holes 25 of thedeposition mask 20. FIG. 10 is a cross-sectional view showing adeposition substrate 90 including a substrate 91 and a deposition layer92 made of a deposition material 82 adhering to the substrate 91.Although not shown, the deposition substrate 90 may further include anelectrode that overlaps the deposition layer 92.

According to this embodiment, it is possible to reduce the generation ofa gap between the deposition mask 20 and the substrate 91. Therefore, itis possible to restrain the deposition material 82 from adhering to thesubstrate 91 in the gap between the deposition mask 20 and the substrate91, thereby improving and the dimensional accuracy and position accuracyof the deposition layer 92. Accordingly, it is possible to reduce amargin provided in the design of the deposition substrate 90 inconsideration of interference between adjacent pixels.

By reducing a margin in the design of the deposition substrate 90 inconsideration of interference between adjacent pixels, it is possible toincrease the pixel density of the deposition substrate 90. In a case inwhich the pixel density in the deposition substrate 90 is constant, thearea of the electrode can be increased while restraining interferencebetween adjacent pixels by reducing the margin. Thus, the luminance ofthe deposition layer 92 can be increased. The drive voltage required toobtain a certain luminance can also be reduced. This makes it possibleto extend the life of an organic EL display device and reduce powerconsumption.

The aforementioned embodiment can be variously modified. Hereinafter,modification examples are described with reference to the drawingsaccording to need. In the below description and the drawings used in thebelow description, a part that can be similarly constituted to the aboveembodiment has the same reference sign as that of corresponding part theabove embodiment, and overlapped description is omitted. In addition,when the effect obtained by the aforementioned embodiment is apparentlyobtained in the modification examples, description thereof is possiblyomitted.

In the above-described embodiment, an example in which one of thesupporting members of the frame 15 is located at the intermediateposition between the third portion 153 and the fourth portion 154 of theframe 15 and this supporting member is referred to as “first supportingmember 61” is shown. In this modified example, as shown in FIG. 11, anexample in which the supporting member is not located at theintermediate position between the third portion 153 and the fourthportion 154 of the frame 15 will be described.

In FIG. 11, an alternate long and short dash line M indicating theintermediate position between the third portion 153 and the fourthportion 154 of the frame 15 does not overlap the supporting member. Inthis case, a pair of supporting members facing each other in the seconddirection D2 across the straight line M may be referred to as “firstsupporting member 61”. In such a case, the warping amount of the twofirst supporting members 61 is determined to be the above-describedfirst warping amount a1. The warping amount of two first supportingmembers 61 may be the same or different.

In FIG. 11, a reference sign Z1 denotes a distance between theintermediate position and the first supporting member 61. A referencesign Z2 denotes a distance between the intermediate position and thesecond supporting member 62. A reference sign Z3 denotes a distancebetween the intermediate position and the third supporting member 63.The distance Z1 is smaller than both the distance Z2 and the distanceZ3.

In this modified example, the second warping amount a2 of the secondsupporting member 62 located closer to the third portion 153 than thefirst supporting member 61 is also larger than the first warping amounta1 of the first supporting member 61. The third warping amount a3 of thethird supporting member 63 located closer to the fourth portion 154 thanfirst supporting member 61 is also larger than the first warping amounta1 of the first supporting member 61. Accordingly, the downward warpingamount of the deposition mask 20 can be maximized at an intermediateposition between the third portion 153 and the fourth portion 154.

FIG. 12 is a plan view illustrating another modified example of thedeposition mask apparatus 10. FIG. 13 is a plan view showing a state inwhich the deposition mask 20 has been removed from the deposition maskapparatus 10 in FIG. 12 in order to clearly show the covering member 70.As shown in FIGS. 12 and 13, the deposition mask apparatus 10 mayfurther include a plurality of covering members 70 extending in thesecond direction D2 which are fixed to the third portion 153 and thefourth portion 154 of the frame 15.

FIG. 14 is a cross-sectional view taken along the line E-E of FIG. 12passing through the first supporting member 61. As shown in FIG. 14, thecovering members 70 may be located closer to the second surface 17 ofthe frame 15 than the deposition mask 20 and the supporter 60. Inaddition, as shown in FIGS. 12 and 14, the covering members 70 may belocated such that each covering member 70 overlaps a gap G between eachtwo deposition masks 20 arranged in the first direction D1 when viewedalong the normal direction of the surface of the deposition masks 20.Thus, the deposition material 82 can be restrained from passing throughthe gap G between the plurality of deposition masks 20 and adhering tothe substrate 91 in the vapor deposition step.

FIG. 15 is a plan view illustrating another modified example of thesupporter 60 fixed to the frame 15. The supporter 60 may further includea plurality of covering members 69 extending in the second direction D2which are arranged in the first direction D1, as well as a plurality ofsupporting members 61 to 67 extending in the first direction D1 whichare arranged in the second direction D2. The plurality of supportingmembers 61 to 67 and the plurality of covering members 69 may beintegrally formed with the same material. The covering members 69 canfunction as with the above-described covering members 70 such that thedeposition material 82 can be restrained from passing through each gap Gbetween each two deposition masks 20 and adhering to the substrate 91 inthe vapor deposition step.

FIG. 16 is a plan view illustrating another modified example of thedeposition mask apparatus 10. As shown in FIG. 16, a plurality ofeffective areas 23 may be arranged not only in the second direction D2but also in the first direction D1 on the deposition mask 20.

Next, with reference to FIGS. 2, 18, and 19, an example of a method formeasuring the preliminary warping amount of the supporting members thatdo not support the deposition mask 20 will be described.

First, as shown in FIG. 2, a deposition mask apparatus 10 including aframe 15, a supporter 60, and a deposition mask 20 fixed to frame 15 isprepared. Next, as shown in FIG. 18, the deposition mask 20 located at aposition where it overlaps the supporter 60 in plan view is removed. Forexample, the deposition mask 20 is cut at a position between a sixthsupporting member 66 and a third portion 153, and the deposition mask 20is also cut at a position between a seventh supporting member 67 and afourth portion 154. Thus, a mask support mechanism 75 including theframe 15 and the supporter 60 in a state of not supporting thedeposition mask 20 can be obtained.

FIG. 19 is a sectional view along the F-F line of FIG. 18. In the masksupport mechanism 75, a supporting member located closer to the thirdportion 153 or the fourth portion 154 of the frame 15 may have a smallerpreliminary warping amount. For example, the second preliminary warpingamount c2 of the second supporting member 62 and the third preliminarywarping amount c3 of the third supporting member 63 are smaller than thefirst preliminary warping amount c1 of the first supporting member 61.The fourth preliminary warping amount c4 of the fourth supporting member64 is smaller than the second preliminary warping amount c2 of thesecond supporting member 62. The fifth preliminary warping amount c5 ofthe fifth supporting member 65 is smaller than the third preliminarywarping amount of deflection c3 of the third supporting member 63. Thesixth preliminary warping amount c6 of the sixth supporting member 66 issmaller than the fourth preliminary warping amount c4 of the fourthsupporting member 64. The seventh preliminary warping amount c7 of theseventh supporting member 67 is smaller than the fifth preliminarywarping amount c5 of the fifth supporting member 65. As a measuringinstrument for measuring the preliminary warping amount, a laserdisplacement meter such as LK-G85 manufactured by KEYENCE CORPORATIONcan be used.

Although some modified examples of the above-described embodiment havebeen described, it is needless to say that a plurality of modifiedexamples may be appropriately combined and applied.

EXAMPLES

Next, the embodiment of the disclosure is described in more detail basedon examples, and the embodiment of the disclosure is not limited to thebelow description of the examples unless the present invention departsfrom its thought.

Example 1

First, as in the case of the example shown in FIG. 3, a frame 15including a first portion 151, a second portion 152, a third portion153, and a fourth portion 154 was prepared. The distance between thefirst portion 151 and the second portion 152 was 1461 mm, and thedistance between the third portion 153 and the fourth portion 154 was877 mm.

Subsequently, while applying tension to seven supporting members 61 to67, a first end 601 and a second end 602 of each of the supportingmembers 61 to 67 were fixed to the first portion 151 and the secondportion 152, respectively, by being welded. Each of the supportingmembers 61 to 67 had a thickness of 100 μm and a width of 5.5 mm.

Subsequently, in a state where a first surface 16 of the frame 15 waslocated above a second surface 17, the preliminary warping amounts ofthe supporting members 61 to 67 were measured using a laser displacementmeter LK-G85 manufactured by KEYENCE CORPORATION. The results are shownbelow.

first preliminary warping amount of first supporting member 61: 233 μm

second preliminary warping amount of second supporting member 62: 174 μm

third preliminary warping amount of third supporting member 63: 203 μm

fourth preliminary warping amount of fourth supporting member 64: 117 μm

fifth preliminary warping amount of fifth supporting member 65: 155 μm

sixth preliminary warping amount of sixth supporting member 66: 73 μm

seventh preliminary warping amount of seventh supporting member 67: 66μm

Subsequently, while applying tension to a deposition mask 20, a thirdend 211 and a fourth end 212 of the deposition mask 20 were fixed to thethird portion 153 and the fourth portion 154, respectively, by beingwelded. The number of deposition masks 20 fixed to the frame 15 was 19.Each deposition mask 20 had a thickness of 30 μm and a width of 71.63mm. The nineteen deposition masks 20 arranged from the first portion 151side to the second portion 152 side are also referred to as “firstdeposition mask”, “second deposition mask”, . . . and “19th depositionmask” respectively.

Subsequently, in a state where the first surface 16 of the frame 15 waslocated above the second surface 17, the warping amounts of the 10thdeposition mask at positions where the 10th deposition mask overlappedthe supporting members 61 to 67 were measured using a laser displacementmeter LK-G85 manufactured by KEYENCE CORPORATION. Namely, the warpingamounts of the supporting members 61 to 67 were measured. The resultsare shown below. In this Example, the position of the upper surface ofthe portion of the supporting members 61 to 67 fixed to the frame 15 isequal to the position of the upper surface of the frame 15. In addition,each deposition mask is fixed on the upper surface of the frame 15.Further, the 10th deposition mask is located at an intermediate positionbetween the first portion 151 and the second portion 152 of the frame15. Therefore, the warping amounts of the 10th deposition mask atpositions where the 10th deposition mask overlaps the supporting members61 to 67 are equal to the warping amounts a1 to a7 of the supportingmembers 61 to 67. The warping amounts of the supporting members 61 to 67calculated based on the warping amounts of the 10th deposition mask areas follows.

first warping amount of first supporting member 61: 420 μm

second warping amount of second supporting member 62: 365 μm

third warping amount of third supporting member 63: 377 μm

fourth warping amount of fourth supporting member 64: 277 μm

fifth warping amount of fifth supporting member 65: 285 μm

sixth warping amount of sixth supporting member 66: 83 μm

seventh warping amount of seventh supporting member 67: 72 μm

In addition, in a state where the first surface 16 of the frame 15 waslocated above the second surface 17, the warping amounts of the first to19th deposition masks in a state of being supported by the supportingmember 61 to 67 were measured using a laser displacement meter LK-G85manufactured by KEYENCE CORPORATION. The results are shown below.

Warping amount of first deposition mask: 144 μm

Warping amount of second deposition mask: 176 μm

Warping amount of third deposition mask: 261 μm

Warping amount of fourth deposition mask: 334 μm

Warping amount of fifth deposition mask: 336 μm

Warping amount of sixth deposition mask: 366 μm

Warping amount of seventh deposition mask: 374 μm

Warping amount of eighth deposition mask: 425 μm

Warping amount of ninth deposition mask: 412 μm

Warping amount of 10th deposition mask: 420 μm

Warping amount of 11th deposition mask: 404 μm

Warping amount of 12th deposition mask: 404 μm

Warping amount of 13th deposition mask: 370 μm

Warping amount of 14th deposition mask: 382 μm

Warping amount of 15th deposition mask: 365 μm

Warping amount of 16th deposition mask: 292 μm

Warping amount of 17th deposition mask: 320 μm

Warping amount of 18th deposition mask: 234 μm

Warping amount of 19th deposition mask: 138 μm

Subsequently, the substrate 91 was brought into contact with the firstto 19th deposition masks to perform the vapor deposition step. FIG. 17shows a deposition layer 92 formed on an electrode 93 on the substrate91. The deposition layer 92 includes a uniform thickness portion 92 aand a shadow portion 92 b. The uniform thickness portion 92 a is aportion of the deposition layer 92 which has a thickness within a rangeof ±0.5% of the average thickness of the deposition layer 92. The shadowportion 92 b is a portion having a thickness smaller than the averagethickness of the deposition layer 92 by 0.5% or more. The averagethickness of the deposition layer 92 is an average value of thethickness of a portion of the deposition layer 92 which overlaps theelectrode 93. Thereafter, the dimensional accuracy and positionalaccuracy of the deposition layer 92 were evaluated. Specifically, foreach of the deposition layers 92 formed using the first to 19thdeposition masks, a distance W1 between the position of the end portionof the electrode 93 and the position of the end portion of the uniformthickness portion 92 a of the deposition layer 92 was measured. Inaddition, it was determined whether the maximum value of the distance W1in each deposition layer 92 was equal to or less than the firstthreshold. The first threshold is, for example, 5.6 μm. As a result, themaximum value of the distance W1 was equal to or less than the firstthreshold. In addition, a width W2 of the shadow portion 92 b wasmeasured for each of the deposition layers 92 formed using the first to19th deposition masks. Further, it was determined whether the width W2of the shadow portion 92 b was less than or equal to the secondthreshold. The second threshold is, for example, 1.0 μm. As a result,the width W2 of the shadow portion 92 b was equal to or smaller than thesecond threshold.

Comparative Example 1

A first end 601 and a second end 602 of each of the supporting members61 to 67 were fixed to the first portion 151 and the second portion 152of the frame 15, respectively, by being welded such that the preliminarywarping amounts of the support members 61 to 67 became equal.Subsequently, as in the case of Example 1, the preliminary warpingamounts of the supporting members 61 to 67 were measured. The resultsare shown below.

first warping amount of first supporting member 61: 68 μm

second warping amount of second supporting member 62: 59 μm

third warping amount of third supporting member 63: 63 μm

fourth warping amount of fourth supporting member 64: 63 μm

fifth warping amount of fifth supporting member 65: 62 μm

sixth warping amount of sixth supporting member 66: 61 μm

seventh warping amount of seventh supporting member 67: 58 μm

Subsequently, as in the case of Example 1, while applying tension to thedeposition mask 20, a third end 211 and a fourth end 212 of thedeposition mask 20 were fixed to the third portion 153 and the fourthportion 154, respectively, by being welded. Next, the warping amounts ofthe first to 19th deposition masks in a state of being supported by thesupporting member 61 to 67 were measured. The results are shown below.

Warping amount of first deposition mask: 59 μm

Warping amount of second deposition mask: 62 μm

Warping amount of third deposition mask: 62 μm

Warping amount of fourth deposition mask: 65 μm

Warping amount of fifth deposition mask: 64 μm

Warping amount of sixth deposition mask: 61 μm

Warping amount of seventh deposition mask: 66 μm

Warping amount of eighth deposition mask: 64 μm

Warping amount of ninth deposition mask: 65 μm

Warping amount of 10th deposition mask: 69 μm

Warping amount of 11th deposition mask: 69 μm

Warping amount of 12th deposition mask: 66 μm

Warping amount of 13th deposition mask: 62 μm

Warping amount of 14th deposition mask: 61 μm

Warping amount of 15th deposition mask: 60 μm

Warping amount of 16th deposition mask: 57 μm

Warping amount of 17th deposition mask: 63 μm

Warping amount of 18th deposition mask: 61 μm

Warping amount of 19th deposition mask: 57 μm

Subsequently, as in the case of Example 1, the vapor deposition step wasperformed using the first to 19th deposition masks, thereby forming adeposition layer 92 on the electrode 93 on the substrate 91. Inaddition, the distance W1 between the position of the end portion of theelectrode 93 and the position of the end portion of the uniformthickness portion 92 a of the deposition layer 92 was measured. As aresult, the maximum value of the distance W1 exceeded the firstthreshold. In addition, the width W2 of the shadow portion 92 b wasmeasured. As a result, the width W2 of the shadow portion 92 b exceededthe second threshold.

As is understood from a comparison between Example 1 and ComparativeExample 1, it was possible to improve the dimensional accuracy andpositional accuracy of the deposition layer 92 by making the warpingamount of the first supporting member 61 located closest to theintermediate position between the third portion 153 and the fourthportion 154 of the frame 15 larger than the warping amounts of the othersupporting members.

The invention claimed is:
 1. A deposition mask apparatus, comprising: aframe including a first portion, a second portion facing the firstportion across an opening in a first direction, a third portion, and afourth portion facing the third portion across the opening in a seconddirection different from the first direction, and including a firstsurface and a second surface that is located opposite to the firstsurface; a supporter including a plurality of supporting members thatare arranged in the second direction, the plurality of supportingmembers including a first end that is fixed to the first portion on thefirst surface and a second end that is fixed to the second portion onthe first surface; and a deposition mask including a third end that isfixed to the third portion on the first surface and a fourth end that isfixed to the fourth portion on the first surface, and including aplurality of holes that are located between the third end and the fourthend, wherein the plurality of supporting members include at least afirst supporting member that is closest to an intermediate positionbetween the third portion and the fourth portion of the frame and asecond supporting member that is located closer to the third portion ofthe frame than the first supporting member, and when the first surfaceof the frame is located above the second surface, the first supportingmember in a state of warping downward from the frame with a firstwarping amount supports the deposition mask from below, and the secondsupporting member in a state of warping downward from the frame with asecond warping amount that is smaller than the first warping amountsupports the deposition mask from below.
 2. The deposition maskapparatus according to claim 1, wherein the plurality of supportingmembers include a third supporting member that is located closer to thefourth portion of the frame than the first supporting member, and whenthe first surface of the frame is located above the second surface, thethird supporting member in a state of warping downward from the framewith a third warping amount that is smaller than the first warpingamount supports the deposition mask from below.
 3. The deposition maskapparatus according to claim 2, wherein the plurality of supportingmembers include a fourth supporting member that is located closer to thethird portion of the frame than the second supporting member and a fifthsupporting member that is located closer to the fourth portion of theframe than the third supporting member, and when the first surface ofthe frame is located above the second surface, the fourth supportingmember in a state of warping downward from the frame with a fourthwarping amount that is smaller than the second warping amount supportsthe deposition mask from below, and the fifth supporting member in astate of warping downward from the frame with a fifth warping amountthat is smaller than the third warping amount supports the depositionmask from below.
 4. The deposition mask apparatus according to claim 1,wherein the supporting members has a thickness that is larger than athickness of the deposition mask at a position where the deposition maskoverlaps the supporting member in plan view.
 5. The deposition maskapparatus according to claim 1, wherein the plurality of supportingmembers has a thickness that is twice or more of a thickness of thedeposition mask at a position where the deposition mask overlaps theplurality of supporting members in plan view.
 6. The deposition maskapparatus according to claim 1, wherein the supporting members has athickness of 50 μm or more.
 7. The deposition mask apparatus accordingto claim 1, wherein the supporting members has a thickness that is 50times or less of a thickness of the deposition mask at a position wherethe deposition mask overlaps the supporting member in plan view.
 8. Thedeposition mask apparatus according to claim 1, wherein the supportingmembers has a thickness of 1 mm or less.
 9. The deposition maskapparatus according to claim 1, wherein the frame has a third surfacefacing the opening, the third surface being located between the firstsurface and the second surface, and the third surface of the firstportion at a position where the first portion overlaps the firstsupporting member in plan view is located closer to the second portionthan the third surface of the first portion at a position where thefirst portion overlaps the second supporting member in plan view. 10.The deposition mask apparatus according to claim 1, wherein the firstportion and the second portion of the frame are shorter than the thirdportion and the fourth portion of the frame.
 11. The deposition maskapparatus according to claim 1, wherein a ratio of a length of the thirdportion and the fourth portion to a length of the first portion and thesecond portion is 1.1 or more.